Project H2020-MSCA-ITN-2015 Outcome
Duration: January 2016 for 42 months.
The goal of the project is to train early-stage researchers in what is referred to as an outstanding challenge in solid mechanics: developing novel solutions for the analysis and design of aerospace and defence structures subjected to extreme loading conditions. Structural elements used in these sectors are frequently subjected to a large variety of unusually severe thermo-mechanical solicitations.
We form a consortium composed by 3 academic beneficiaries and 2 industrial beneficiaries which aims at developing specific training for early-stage researchers within the field of aerospace and defense structures subjected to severe thermo-mechanical loads. The leitmotif of this ITN is to train creative and innovative researchers ready to face structural-engineering challenges which arise in the vanguard of technological innovation. The academic beneficiaries are renowned research groups in the field of solid mechanics of three different Universities located in European (or associated) countries: University Carlos III of Madrid (Spain), University of Lorraine (France) and Technion (Israel). The industrial beneficiaries are high-tech SMEs working in the sectors of aerospace and defence, whose hallmarkis the technological innovation: SERTEC (Spain) and CIMULEC (France).In addition, the network includes 2 industrial partners: ECE (Spain) and RAFAEL (Israel). These are large companies with worldwide operational resources, global leaders in the areas of aerospace and defence technology.
Project Eureka/Euripides: « BoB », Board on Board Technology.
Industrial partners: Thales, CIMULEC, AT&S, CELESTICA.
Academic partners: Université de Brno, Université de Vienne, LEM3.
Theme: Circuits imprimés avec composants enterrés.
The BoB project is based on an innovative solution, which consists of dividing the printed circuit board into two finer ones, interconnected by a very high density flexible circuit and through-through pins. Two solutions are studied:
Each thin card will integrate passive chips into cavities and the interconnection is ensured by a low cost flexible circuit based on the creation of a laser structure;
Each thin card will incorporate embedded passive chips in its 0.8 mm core and the interconnection will be provided by a separate flexible circuit assembled by the EMS partner.
The LEM3 collaborates with CIMULEC to validate the solution with underground components taking into account residual constraints related to the process.
Duration: 1/12/2011 – 30/09/2015
Publications and conferences: ESMC 2015, CFM 2015, 1 publication in IJSS 2015, 1 being submitted in Microelectronics Reliability
CZARNOTA C., KOWALCZYK-GAJEWSKA, SALAHOUELDJ A., MARTINY M., MERCIER S., Modeling of the cyclic behavior of elastic-viscoplastic composites by the additive tangent Mori-Tanaka approach and validation by finite element calculations, 2015, vol. 56-57, pp 96-117